Пожертвування 15 вересня 2024 – 1 жовтня 2024 Про збір коштів

Advanced Metallization for Ulsi Applications

Main
Computers - Programming
Advanced Metallization for Ulsi...

Advanced Metallization for Ulsi Applications

T. S. Cale, F. S. Pintchovski

0 / 0

Наскільки Вам сподобалась ця книга?

Яка якість завантаженого файлу?

Скачайте книгу, щоб оцінити її якість

Яка якість скачаних файлів?

Категорії:

Computers - Programming

Рік:

1999

Видавництво:

Materials Research Society

Мова:

english

Сторінки:

379

ISBN 10:

1558991921

ISBN 13:

9781558991927

Серії:

Materials Research Society

Файл:

DJVU, 4.68 MB

IPFS:

,

english, 1999

Читати Онлайн

Виконується конвертація в

Конвертація в не вдалась

Можливо вас зацікавить

John M. Andrews and George K. Celler (Editors) — ULSI Science and Technology 1991

C. Y. Chang, S. M. Sze — Ulsi Technology

G Eranna — Crystal growth and evaluation of silicon for VLSI and ULSI

K. N. Tu, James W. Mayer, J. M. Poate, Lih J. Chen — Advanced Metallization for Future Ulsi: Symposium Held April 8-11, 1996, San Francisco, California, U.S.A.

Tapan Gupta (auth.) — Copper Interconnect Technology

Strausser, Yale — Characterization in Silicon Processing

Danilo Crippa, Daniel L. Rode and Maurizio Masi (Eds.) — Silicon Epitaxy

Norman G. Einspruch, Simon S. Cohen, Gennady Sh Sildenblat — Vlsi Metallization

Ohring M. — Materials science of thin films

Milton Ohring — The materials science of thin films

Krishna Seshan，Dominic Schepis — Handbook of Thin Film Deposition (Fourth Edition)

Stephen A. Campbell — The Science and Engineering of Microelectronic Fabrication

Stephen A. Campbell — Fabrication Engineering at the Micro- and Nanoscale

Tina L. Lamers, Beth L. Pruitt (auth.), Reza Ghodssi, Pinyen Lin (eds.) — MEMS Materials and Processes Handbook

Y. Shacham-Diamand (auth.), Yosi Shacham-Diamand, Tetsuya Osaka, Madhav Datta, Takayuki Ohba (eds.) — Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Krishna Seshan (Author) — Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon

Geraldine Cogin Shwartz (Author) — Handbook of Semiconductor Interconnection Technology

Sami Franssila — Introduction to Microfabrication

Sami Franssila(auth.) — Introduction to Microfabrication, Second Edition

Sami Franssila — Introduction to Microfabrication

Geraldine Cogin Schwartz, K.V. Srikrishnan, Arthur Bross — Handbook of Semiconductor Interconnection Technology

Hugh O. Pierson — Handbook of Chemical Vapor Depostion [i.e. Deposition] (CVD)

Krishna Seshan — Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon.

Klaus K Schuegraf; Krishna Seshan — Handbook of Thin Film Deposition Processes and Techniques : Principles, Methods, Equipment and Applications

Xiao, Hong — Introduction to Semiconductor Manufacturing Technology (2nd Edition)

Hong Xiao — Introduction to Semiconductor Manufacturing Technology

Mohamed Gad-el-Hak — The MEMS Handbook MEMS Design

Jong-Hee Park, T. S. Sudarshan — Surface Engineering Series Volume 2 Chemical Vapor Deposition

Stanley Wolf, Richard N. Tauber — Silicon Processing for the VLSI Era, Vol. 1: Process Technology

Kumar Shubham, Ankaj Gupta — Integrated Circuit Fabrication

Sarangan, Andrew — Nanofabrication : principles to laboratory practice

Srinivasan Sivaram (auth.) — Chemical Vapor Deposition: Thermal and Plasma Deposition of Electronic Materials

Yosi Shacham-Diamand, Yasuhiro Horiike, David P. Favreau, Yosi Shacham-Diamand, Yasuhiro Horiike, David P. Favreau, Berkeley Continuing Education in engineering University of California — Advanced Metallization for Ulsi Applications in 1993: Proceedings of the Conference Held October 5-7, 1993, San Diego, California, U.S.A., and

R. C. Ellwanger, S. Q. Wang — Advanced Metallization and Interconnect Systems for Ulsi Applications in 1995

Robert Havemann, J. Schmitz, H. Komiyama, K. Tsubouchi, Berkeley Continuing Education in engineering University of California — Advanced Metallization & Interconnect Systems for Ulsi Applications in 1996: Materials Research Society Conference Proceedings

R. Cheung, J. Klein, K. Tsubouchi, M. Murakami, N. Kobayashi — Advanced Metallization and Interconnect Systems for Ulsi Applications in 1997

Ключові фрази